Highest throughput, highest resolution large area deprocessing, sample preparation and characterization of 10nm devices
The Helios G4 PFIB HXe DualBeam™ System provides unique capabilities to enable damage-free delayering of 10nm semiconductor devices and advanced failure analysis of 3D packages, in addition to a wide range of other large area FIB processing applications.
Meet our newest innovative products
Our latest next-generation products focus on advanced analytical capabilities for failure analysis and process control. These solutions are designed to help increase productivity in semiconductor fabs and labs by improving quality control and yield in the manufacture of 3D NAND, logic, DRAM, analog and display devices.