FEI's DualBeam™ systems are the preferred solution for 3D microscopy and analysis serving material characterization, industrial failure analysis and process control applications. They are designed to deliver integrated sample preparation and microanalysis below 1nm for high throughput semiconductor and data storage fabs and materials science and life science labs.
Four FEI product families offer DualBeam™ systems, as well as five additional tools specially designed for NanoElectronics:
The Nova family of DualBeam™ (FIB/SEM) systems are complete nanotechnology labs in a single tool. The Nova™ 200 NanoLab and the Nova™ 600 NanoLab are commonly used in nanostructure assembly, nanoscale prototyping, machining, characterization, and analysis of structures below 100nm.
The Quanta 200 3D DualBeam™ (FIB/SEM), with its tungsten electron column, focused ion beam column and gas injector
system, offers capabilities for site-specific cross sectioning, ion beam imaging, material deposition and etching, analysis and TEM sample preparation.
The Helios NanoLab™ provides outstanding imaging with a novel electron beam column that includes, along with a complete suite of detectors, a new imaging chain that achieves superb contrast and resolution, while the focused ion beam’s (FIB) superior performance provides fast milling and sample preparation applications.
Two DualBeam™ (FIB/SEM) models, the Strata 400 and Strata 400 S/TEM, support high-resolution analysis and offer complete sample management for research labs and the semiconductor and data storage industries. Speed your "time to answer" by performing material and defect analysis on a single tool that delivers high-resolution images and compositional data.
DualBeam™ Systems for NanoElectronics
The Expida™ Family offers two full wafer DualBeam microscopes with 300mm capability for fast and accurate 3D defect characterization, failure analysis and transmission electron microscope (TEM) sample preparation.
Data storage head manufacturers can increase established yields with precise structural measurements and imaging using the FEI Certus-3D Wafer DualBeam system. With full wafer auto-loading and critical 3D analysis of data storage devices in a clean room environment, the Certus-3D system shortens time to market by enabling critical engineering and development faster than other electron and/or ion-beam technologies. With its TEMLink™ 100 option, the Certus-3D system also can automate TEM sample preparation for higher-resolution imaging and analysis. The Certus-3D system uses programmable recipes for precise and repeatable location and milling of samples, wafer after wafer. Extracting the samples from wafers is automated by the FEI TEMLink™ system to reduce the time and risk associated with the lift-out process. Contact the FEI sales team for more information.
Learn more about the TEMLink 100 [PDF 948KB]
For more information, contact the FEI sales team
The CLM-3D 300mm DualBeam™ (FIB/ SEM) is a full wafer autoloading system for automated, digital 3D analysis of semiconductor devices in a clean room environment. It combines FEI's latest generation electron column and high-current ion column to provide high precision cross-sectional metrology.
Learn more about the CLM-3D [PDF 652KB]
FEI's Defect Analyzer 300 HP delivers a powerful combination of tool automation, industry-leading electron imaging, unsurpassed focused ion beam milling, and proprietary beam chemistry technology to enable three-dimensional analysis of advanced process defects.
Learn more about the Defect Analyzer 300 HP [PDF 936KB]
FEI's Altura 855 offers the ultimate performance for defect characterization, failure analysis, and transmission electron microscope (TEM) sample preparation on patterned and unpatterned wafers, as well as wafer pieces and packaged parts.
Learn more about the Altura 855 [PDF 492KB]